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| GET READY FOR AMD RYZEN™ 5000 SERIES GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for latest AMD Ryzen™ 5000 Series Processors. The all-new design is a testament to GIGABYTE dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0, USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 5000 Series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system. |
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AMD StoreMI Technology GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system. |
| Ultimate Power Design To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards. |
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Advanced Thermal Design X570 AORUS MASTER reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink, a heatpipe, and a thermal baseplate, to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers |
| Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad X570 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period. |
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Smart Fan Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation. |
| Full PCIe 4.0 Design X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors, PCIe 4.0 B-clock Tuning IC, and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts. The inclusion of the PCIe 4.0 B-Clock Tuning IC and a server grade PCB helps you unlock the best performance from PC peripherals. |
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Next Generation Connectivity A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed. |
| Multi-Zone Light Show Design Now offering more LED customizations than ever, users can truly adapt their PC to represent their lifestyle. With full RGB support and a redesigned RGB Fusion 2.0 application, the user has complete control over the LEDs which surround the motherboard. |
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Smart Fan 5 With Smart Fan 5 users can ensure that their gaming PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly. |
